Conference Highlights Career Pathways in Microelectronics and Radiation Hardening

Alabama A&M University students are gaining national exposure in advanced research after presenting their work at the inaugural SCALE-Con, hosted by Purdue University as part of the Scalable Asymmetric Lifecycle Engagement (SCALE) program, a national consortium focused on microelectronics workforce development.

Held at the Ronald Reagan Building and International Trade Center, SCALE-Con 2026 convened students, faculty, industry partners and government leaders to explore emerging technologies, share research and strengthen the nation’s semiconductor workforce.

Representing AAMU were Kaden Bowers, a sophomore mechanical engineering major from Birmingham, Alabama; Madison Baker, a junior mechanical engineering major from Columbus, Ohio; and Somer Holyfield, a senior mechanical engineering major from Huntsville, Alabama.

The students were selected to attend after several months of research in radiation hardening under the guidance of technical advisors Dr. Mebougna Drabo and project PI, Terry Miller, director of experiential learning and outreach and professor of computer science.

Throughout the conference, students participated in keynote sessions, panel discussions and networking opportunities with industry and government leaders. The highlight of the experience was the research demonstration session, where the AAMU team presented its project, “Enhancing Materials Research at AAMU with the Rigaku DSCvesta System.”

The project expands AAMU’s capabilities in thermal characterization, building on existing expertise in surface analysis to better understand how radiation affects materials used in defense, space and nuclear applications. The research also provides hands-on training in advanced thermal methods for students preparing to enter high-demand technical fields.

“I gained valuable insight into a wide range of student-led research projects and the innovative work being done across different campuses,” said Baker. “What made SCALE-Con especially meaningful was the opportunity to connect with fellow students on a personal level. Beyond discussing research, I truly enjoyed building relationships, sharing experiences, and forming new connections that I believe will last well beyond the conference.”

The presentation format mirrored AAMU’s STEM Day, with projects organized across SCALE’s technical areas, including heterogeneous integration, compound semiconductors, radiation hardening, system-on-chip technologies and artificial intelligence.

The SCALE program supports students pursuing careers in microelectronics and radiation hardening, most often in mechanical and electrical engineering disciplines.

SCALE includes 33 partner universities nationwide, including six historically Black colleges and universities: Alabama A&M University, Tennessee State University, North Carolina A&T State University, Morgan State University, Savannah State University and Tougaloo College.

The trip was funded by Purdue University, the lead institution of the SCALE program, which launched in 2024 to prepare students for emerging careers in microelectronics through specialized coursework, mentoring, internships and research opportunities.

“SCALE-Con was a really great experience for me because it gave me the chance to connect with professionals and other students who are like minded,” said Bowers. “The best part was being able to build genuine connections and hear real stories from people who have been and are in positions I aspire to reach.”